A proposed visible spectrum nanoscale imaging method requires material with permittivity values much larger than those available in real world materials to shrink the visible wavelength to attain the desired resolution. It has been proposed that the extraordinarily slow propagation experienced by light guided along plasmon resonant structures is a viable approach to obtaining these short wavelengths. To assess the feasibility of such a system, an effective medium model of a chain of Noble metal plasmonic nanospheres is developed, leading to a straightforward calculation of the waveguiding properties. Evaluation of other models for such structures that have appeared in the literature, including an eigenvalue problem nearest neighbor approximation, a multi- neighbor approximation with retardation, and a method-of-moments method for a finite chain, show conflicting expectations of such a structure. In particular, recent publications suggest the possibility of regions of invalidity for eigenvalue problem solutions that are considered far below the onset of guidance, and for solutions that assume the loss is low enough to justify perturbation approximations. Even the published method-of-moments approach suffers from an unjustified assumption in the original interpretation, leading to overly optimistic estimations of the attenuation of the plasmon guided wave. In this work it is shown that the method of moments approach solution was dominated by the radiation from the source dipole, and not the waveguiding behavior claimed. If this dipolar radiation is removed the remaining fields ought to contain the desired guided wave information. Using a Prony's-method-based algorithm the dispersion properties of the chain of spheres are assessed at two frequencies, and shown to be dramatically different from the optimistic expectations in much of the literature. A reliable alternative to these models is to replace the chain of spheres with an effective medium model, thus mapping the chain problem into the well-known problem of the dielectric rod. The solution of the Green function problem for excitation of the symmetric longitudinal mode (TM01) is performed by numerical integration. Using this method the frequency ranges over which the rod guides and the associated attenuation are clearly seen. The effective medium model readily allows for variation of the sphere size and separation, and can be taken to the limit where instead of a chain of spheres we have a solid Noble metal rod. This latter case turns out to be the optimal for minimizing the attenuation of the guided wave. Future work is proposed to simulate the chain of photonic nanospheres and the nanowire using finite-difference time-domain to verify observed guided behavior in the Green's function method devised in this thesis and to simulate the proposed nanosensing devices.

The medical industry has benefited greatly by electronic integration resulting in the explosive growth of active medical implants. These devices often treat and monitor chronic health conditions and require very minimal power usage. A key part of these medical implants is an ultra-low power two way wireless communication system. This enables both control of the implant as well as relay of information collected. This research has focused on a high performance receiver for medical implant applications. One commonly quoted specification to compare receivers is energy per bit required. This metric is useful, but incomplete in that it ignores Sensitivity level, bit error rate, and immunity to interferers. In this study exploration of receiver architectures and convergence upon a comprehensive solution is done. This analysis is used to design and build a system for validation. The Direct Conversion Receiver architecture implemented for the MICS standard in 0.18 µm CMOS process consumes approximately 2 mW is competitive with published research.

This thesis describes the design process used in the creation of a two stage cellular power amplifier. A background for understanding amplifier linearity, device properties, and ACLR estimation is provided. An outline of the design goals is given with a focus on linearity with high efficiency. The full design is broken into smaller elements which are discussed in detail. The main contribution of this thesis is the description of a novel interstage matching network topology for increasing efficiency. Ultimately the full amplifier design is simulated and compared to the measured results and design goals. It was concluded that the design was successful, and used in a commercially available product.

Asymptotic and Numerical methods are popular in applied electromagnetism. In this work, the two methods are applied for collimated antennas and calibration targets, respectively. As an asymptotic method, the diffracted Gaussian beam approach (DGBA) is developed for design and simulation of collimated multi-reflector antenna systems, based upon Huygens principle and independent Gaussian beam expansion, referred to as the frames. To simulate a reflector antenna in hundreds to thousands of wavelength, it requires 1E7 - 1E9 independent Gaussian beams. To this end, high performance parallel computing is implemented, based on Message Passing Interface (MPI). The second part of the dissertation includes the plane wave scattering from a target consisting of doubly periodic array of sharp conducting circular cones by the magnetic field integral equation (MFIE) via Coiflet based Galerkin's procedure in conjunction with the Floquet theorem. Owing to the orthogonally, compact support, continuity and smoothness of the Coiflets, well-conditioned impedance matrices are obtained. Majority of the matrix entries are obtained in the spectral domain by one-point quadrature with high precision. For the oscillatory entries, spatial domain computation is applied, bypassing the slow convergence of the spectral summation of the non-damping propagating modes. The simulation results are compared with the solutions from an RWG-MLFMA based commercial software, FEKO, and excellent agreement is observed.

Multiport antennas offer greater design flexibility than traditional one-port designs. An antenna array is a special case of a multiport antenna. If the antenna's inter-element spacing is electrically small, the antenna is capable of achieving superdirectivity. Superdirective antenna arrays are known to be narrow band and have low radiation resistance which leads to low radiation efficiency and high VSWR. However, by increasing the self-impedance of the antenna elements, the radiation resistance is increased but the bandwidth remains narrow. A design methodology is developed using the ability to superimpose electric fields and multi-objective optimization to design antenna feed networks. While the emphasis in this dissertation is on antenna arrays and superdirectivity, the design methodology is general and can be applied to other multiport antennas. The design methodology is used to design a multiport impedance-matching network and optimize both the input impedance and radiation pattern of a two-port superdirective antenna array. It is shown that the multiport impedance-matching network is capable of improving the input impedance of the antenna array while maintaining high directionality. The antenna design is critical for the methodology to improve the bandwidth and radiation characteristics of the array. To double the bandwidth of the two-port impedance matched superdirective antenna array, a three-port Yagi-Uda antenna design is demonstrated. The addition of the extra antenna element does not increase the footprint of the antenna array. The design methodology is then used to design a symmetrical antenna array capable of steering its main beam in two directions.

Semiconductor device scaling has kept up with Moore's law for the past decades and they have been scaling by a factor of half every one and half years. Every new generation of device technology opens up new opportunities and challenges and especially so for analog design. High speed and low gain is characteristic of these processes and hence a tradeoff that can enable to get back gain by trading speed is crucial. This thesis proposes a solution that increases the speed of sampling of a circuit by a factor of three while reducing the specifications on analog blocks and keeping the power nearly constant. The techniques are based on the switched capacitor technique called Correlated Level Shifting. A triple channel Cyclic ADC has been implemented, with each channel working at a sampling frequency of 3.33MS/s and a resolution of 14 bits. The specifications are compared with that based on a traditional architecture to show the superiority of the proposed technique.

High-Resistivity Silicon (HRS) substrates are important for low-loss, high-performance microwave and millimeter wave devices in high-frequency telecommunication systems. The highest resistivity of up to ~10,000 ohm.cm is Float Zone (FZ) grown Si which is produced in small quantities and moderate wafer diameter. The more common Czochralski (CZ) Si can achieve resistivities of around 1000 ohm.cm, but the wafers contain oxygen that can lead to thermal donor formation with donor concentration significantly higher (~1015 cm-3) than the dopant concentration (~1012-1013 cm-3) of such high-resistivity Si leading to resistivity changes and possible type conversion of high-resistivity p-type silicon. In this research capacitance-voltage (C-V) characterization is employed to study the donor formation and type conversion of p-type High-resistivity Silicon-On-Insulator (HRSOI) wafers and the challenges involved in C-V characterization of HRSOI wafers using a Schottky contact are highlighted. The maximum capacitance of bulk or Silicon-On-Insulator (SOI) wafers is governed by the gate/contact area. During C-V characterization of high-resistivity SOI wafers with aluminum contacts directly on the Si film (Schottky contact); it was observed that the maximum capacitance is much higher than that due to the contact area, suggesting bias spreading due to the distributed transmission line of the film resistance and the buried oxide capacitance. In addition, an "S"-shape C-V plot was observed in the accumulation region. The effects of various factors, such as: frequency, contact and substrate sizes, gate oxide, SOI film thickness, film and substrate doping, carrier lifetime, contact work-function, temperature, light, annealing temperature and radiation on the C-V characteristics of HRSOI wafers are studied. HRSOI wafers have the best crosstalk prevention capability compared to other types of wafers, which plays a major role in system-on-chip configuration to prevent coupling between high frequency digital and sensitive analog circuits. Substrate crosstalk in HRSOI and various factors affecting the crosstalk, such as: substrate resistivity, separation between devices, buried oxide (BOX) thickness, radiation, temperature, annealing, light, and device types are discussed. Also various ways to minimize substrate crosstalk are studied and a new characterization method is proposed. Owing to their very low doping concentrations and the presence of oxygen in CZ wafers, HRS wafers pose a challenge in resistivity measurement using conventional techniques such as four-point probe and Hall measurement methods. In this research the challenges in accurate resistivity measurement using four-point probe, Hall method, and C-V profile are highlighted and a novel approach to extract resistivity of HRS wafers based on Impedance Spectroscopy measurements using polymer dielectrics such as Polystyrene and Poly Methyl Methacrylate (PMMA) is proposed.

The high cut-off frequency of deep sub-micron CMOS technologies has enabled the integration of radio frequency (RF) transceivers with digital circuits. However, the challenging point is the integration of RF power amplifiers, mainly due to the low breakdown voltage of CMOS transistors. Silicon-on-insulator (SOI) metal semiconductor field effect transistors (MESFETs) have been introduced to remedy the limited headroom concern in CMOS technologies. The MESFETs presented in this thesis have been fabricated on different SOI-CMOS processes without making any change to the standard fabrication steps and offer 2-30 times higher breakdown voltage than the MOSFETs on the same process. This thesis explains the design steps of high efficiency and wideband RF transmitters using the proposed SOI-CMOS compatible MESFETs. This task involves DC and RF characterization of MESFET devices, along with providing a compact Spice model for simulation purposes. This thesis presents the design of several SOI-MESFET RF power amplifiers operating at 433, 900 and 1800 MHz with ~40% bandwidth. Measurement results show a peak power added efficiency (PAE) of 55% and a peak output power of 22.5 dBm. The RF-PAs were designed to operate in Class-AB mode to minimize the linearity degradation. Class-AB power amplifiers lead to poor power added efficiency, especially when fed with signals with high peak to average power ratio (PAPR) such as wideband code division multiple access (W-CDMA). Polar transmitters have been introduced to improve the efficiency of RF-PAs at backed-off powers. A MESFET based envelope tracking (ET) polar transmitter was designed and measured. A low drop-out voltage regulator (LDO) was used as the supply modulator of this polar transmitter. MESFETs are depletion mode devices; therefore, they can be configured in a source follower configuration to have better stability and higher bandwidth that MOSFET based LDOs. Measurement results show 350 MHz bandwidth while driving a 10 pF capacitive load. A novel polar transmitter is introduced in this thesis to alleviate some of the limitations associated with polar transmitters. The proposed architecture uses the backgate terminal of a partially depleted transistor on SOI process, which relaxes the bandwidth and efficiency requirements of the envelope amplifier in a polar transmitter. The measurement results of the proposed transmitter demonstrate more than three times PAE improvement at 6-dB backed-off output power, compared to the traditional RF transmitters.

During the last decades the development of the transistor and its continuous down-scaling allowed the appearance of cost effective wireless communication systems. New generation wideband wireless mobile systems demand high linearity, low power consumption and the low cost devices. Traditional RF systems are mainly analog-based circuitry. Contrary to digital circuits, the technology scaling results in reduction on the maximum voltage swing which makes RF design very challenging. Pushing the interface between the digital and analog boundary of the RF systems closer to the antenna becomes an attractive trend for modern RF devices. In order to take full advantages of the deep submicron CMOS technologies and digital signal processing (DSP), there is a strong trend towards the development of digital transmitter where the RF upconversion is part of the digital-to-analog conversion (DAC). This thesis presents a new digital intermediate frequency (IF) to RF transmitter for 2GHz wideband code division multiple access (W-CDMA). The proposed transmitter integrates a 3-level digital IF current-steering cell, an up-conversion mixer with a tuned load and an RF variable gain amplifier (RF VGA) with an embedded finite impulse response (FIR) reconstruction filter in the up-conversion path. A 4th-order 1.5-bit IF bandpass sigma delta modulator (BP SDM) is designed to support in-band SNR while the out-of-band quantization noise due to the noise shaping is suppressed by the embedded reconstruction filter to meet spectrum emission mask and ACPR requirements. The RF VGA provides 50dB power scaling in 10-dB steps with less than 1dB gain error. The design is fabricated in a 0.18um CMOS technology with a total core area of 0.8 x 1.6 mm2. The IC delivers 0dBm output power at 2GHz and it draws approximately 120mA from a 1.8V DC supply at the maximum output power. The measurement results proved that a digital-intensive digital IF to RF converter architecture can be successfully employed for WCDMA transmitter application.

A dual-channel directional digital hearing aid (DHA) front-end using a fully differential difference amplifier (FDDA) based Microphone interface circuit (MIC) for a capacitive Micro Electro Mechanical Systems (MEMS) microphones and an adaptive-power analog font end (AFE) is presented. The Microphone interface circuit based on FDDA converts the capacitance variations into voltage signal, achieves a noise of 32 dB SPL (sound pressure level) and an SNR of 72 dB, additionally it also performs single to differential conversion allowing for fully differential analog signal chain. The analog front-end consists of 40dB VGA and a power scalable continuous time sigma delta ADC, with 68dB SNR dissipating 67u¬W from a 1.2V supply. The ADC implements a self calibrating feedback DAC, for calibrating the 2nd order non-linearity. The VGA and power scalable ADC is fabricated on 0.25 um CMOS TSMC process. The dual channels of the DHA are precisely matched and achieve about 0.5dB gain mismatch, resulting in greater than 5dB directivity index. This will enable a highly integrated and low power DHA