In the last few decades, extensive research efforts have been focused on scaling down silicon-based complementary metal-oxide semiconductor (CMOS) technology to enable the continuation of Moore’s law. State-of-art CMOS includes fully depleted silicon-on-insulator (FDSOI) field-effect-transistors (FETs) with ultra-thin silicon channels (6 nm), as well as other three-dimensional (3D) device architectures like Fin-FETs, nanosheet FETs, etc. Significant research efforts have characterized these technologies towards various applications, and at different conditions including a wide range of temperatures from room temperature (300 K) down to cryogenic temperatures. Theoretical efforts have studied ultrascaled devices using Landauer theory to further understand their transport properties and predict their performance in the quasi-ballistic regime.Further scaling of CMOS devices requires the introduction of new semiconducting channel materials, as now established by the research community. Here, two-dimensional (2D) semiconductors have emerged as a promising candidate to replace silicon for next-generation ultrascaled CMOS devices. These emerging 2D semiconductors also have applications beyond CMOS, for example in novel memory, neuromorphic, and spintronic devices. Graphene is a promising candidate for spintronic devices due to its outstanding spin transport properties as evidenced by numerous studies in non-local lateral spin valve (LSV) geometries. The essential components of graphene-based LSV, such as graphene FETs, metal-graphene contacts, and tunneling barriers, were individually investigated as part of this doctoral dissertation. In this work, several contributions were made to these CMOS and beyond CMOS technologies. This includes comprehensive characterization and modeling of FDSOI nanoscale FETs from room temperature down to cryogenic temperatures. Using Landauer theory for nanoscale transistors, FDSOI devices were analyzed and modeled under quasi-ballistic operation. This was extended towards a virtual-source modeling approach that accounts for temperature-dependent quasi-ballistic transport and back-gate biasing effects. Additionally, graphene devices with ultrathin high-k gate dielectrics were investigated towards FETs, non-volatile memory, and spintronic devices. New contributions were made relating to charge trapping effects and their impact on graphene device electrostatics (Dirac voltage shifts) and transport properties (impact on mobility and conductivity). This work also studied contact resistance and tunneling effects using transfer length method (TLM) graphene FET structures and magnetic tunneling junction (MTJ) towards graphene-based LSV.

The research of alternative materials and new device architectures to exceed the limits of conventional silicon-based devices has been sparked by the persistent pursuit of semiconductor technology scaling. The development of tungsten diselenide (WSe2) and molybdenum disulfide (MoS2), well-known member of the transition metal dichalcogenide (TMD) family, has made great strides towards ultrascaled two-dimensional (2D) field-effect-transistors (FETs). The scaling issues facing silicon-based complementary metal-oxide-semiconductor (CMOS) technologies can be solved by 2D FETs, which show extraordinary potential.This dissertation provides a comprehensive experimental analysis relating to improvements in p-type metal-oxide-semiconductor (PMOS) FETs with few-layer WSe2 and high-κ metal gate (HKMG) stacks. Compared to this works improved methods, standard metallization (more damaging to underlying channel) results in significant Fermi-level pinning, although Schottky barrier heights remain small (< 100 meV) when using high work function metals. Temperature-dependent analysis reveals a dominant contribution to contact resistance from the damaged channel access region. Thus, through less damaging metallization methods combined with strongly scaled HKMG stacks significant improvements were achieved in contact resistance and PMOS FET overall performance. A clean contact/channel interface was achieved through high-vacuum evaporation and temperature-controlled stepped deposition. Theoretical analysis using a Landauer transport adapted to WSe2 Schottky barrier FETs (SB-FETs) elucidates the prospects of nanoscale 2D PMOS FETs indicating high-performance towards the ultimate CMOS scaling limit. Next, this dissertation discusses how device electrical characteristics are affected by scaling of equivalent oxide thickness (EOT) and by adopting double-gate FET architectures, as well as how this might support CMOS scaling. An improved gate control over the channel is made possible by scaling EOT, improving on-off current ratios, carrier mobility, and subthreshold swing. This study also elucidates the impact of EOT scaling on FET gate hysteresis attributed to charge-trapping effects in high-κ-dielectrics prepared by atomic layer deposition (ALD). These developments in 2D FETs offer a compelling alternative to conventional silicon-based devices and a path for continued transistor scaling. This research contributes to ongoing efforts in 2D materials for future semiconductor technologies. Finally, this work introduces devices based on emerging Janus TMDs and bismuth oxyselenide (Bi2O2Se) layered semiconductors.

Gallium Nitride (GaN) is uniquely suited for Radio Frequency (RF) and power electronic applications due to its intrinsically high saturation velocity and high mobility compared to Silicon and Silicon Carbide (SiC). High Electron Mobility Transistors (HEMTs) have remained the primary topology for GaN transistors in RF applications. However, GaN HEMTs suffer from a variety of issues such as current crowding, lack of enhancement mode (E-Mode) operation and non-linearity. These drawbacks slow the widespread adoption of GaN devices for ultra-low voltage (ULV) applications such as voltage regulators, automotive and computing applications. E-mode operation is especially desired in low-voltage high frequency switching applications. In this context, Fin Field Effect Transistors (FinFETs) offer an alternative topology for ULV applications as opposed to conventional HEMTs. Recent advances in material processing, high aspect ratio epitaxial growth and etching methods has led to an increased interest in 3D nanostructures such as Nano-FinFETs and Nanowire FETs. A typical 3D nano-FinFET is the AlGaN/GaN Metal Insulator Semiconductor (MIS) FET wherein a layer of Al2O3 surrounds the AlGaN/GaN fin. The presence of the side gates leads to additional lateral confinement of the 2D Electron Gas (2DEG). Theoretical calculations of transport properties in confined systems such as AlGaN/GaN Finfets are scarce compared to those of their planar HEMT counterparts. A novel simulator is presented in this dissertation, which employs self-consistent solution of the coupled 1D Boltzmann – 2D Schrödinger – 3D Poisson problem, to yield the channel electrostatics and the low electric field transport characteristics of AlGaN/GaN MIS FinFETs. The low field electron mobility is determined by solving the Boltzmann transport equation in the Quasi-1D region using 1D Ensemble Monte Carlo method. Three electron-phonon scattering mechanisms (acoustic, piezoelectric and polar optical phonon scattering) and interface roughness scattering at the AlGaN/GaN interface are considered in this theoretical model. Simulated low-field electron mobility and its temperature dependence are in agreement with experimental data reported in the literature. A quasi-1D version of alloy clustering model is derived and implemented and the limiting effect of alloy clustering on the low-field electron mobility is investigated for the first time for MIS FinFET device structures.

As the single-junction silicon solar cell is approaching its theoretical efficiency limits, the loss from shading and resistance is gaining increasing attention. The metal grid pattern may cause an efficiency loss up to 1–3%abs (absolute percentage) depending on the grid’s materials and structure.Many attempts have been proposed to reduce the loss caused by the contacts and module. Among them, the monolithic solar cell, which is a solar cell with multiple string cells on the same wafer and connected in a series, presents advantages of low output current, busbar-free contact, minimized interconnection space, and ohmic loss reduction. However, this structure also introduces a lateral forward bias current through the base region, which severely degrades the cell’s performance. In addition, this interconnection in the base region has partially shunted certain solar cells in the monolithic cell, which created a mismatch between string cells. For the last few decades, researchers have used different methods such as etching trenches or enlarging the distance between the neighboring string cells to solve this problem. However, these methods were both ineffective and defective. In this work, a novel method of suppressing the lateral forward bias current is proposed. By adding a very high surface recombination to the mid-region between the string cells, the carrier density in the mid-region can be decreased close to the doping density. Thus, the resistivity in the mid-region can be increased tenfold or more. As a result, the lateral forward bias current is greatly reduced. Other methods to reduce lateral forward bias current include optimizing the width of the mid-region, shading the mid-region, reducing the base doping and base thickness which can be used to reduce the mismatch as well. Another method has been proposed to calculate the minimum efficiency loss of a monolithic cell compared to the baseline solar cell. As a result, the monolithic cell could potentially gain more advantages over the baseline solar cells with a thinner and low-doped wafer. A monolithic solar cell with innovative designs is presented in this work which shows an efficiency that is potentially higher than that of normal solar cells.

Few-layer black phosphorous (FLBP) is one of the most important two-dimensional (2D) materials due to its strongly layer-dependent quantized bandstructure, which leads to wavelength-tunable optical and electrical properties. This thesis focuses on the preparation of stable, high-quality FLBP, the characterization of its optical properties, and device applications.Part I presents an approach to preparing high-quality, stable FLBP samples by combining O2 plasma etching, boron nitride (BN) sandwiching, and subsequent rapid thermal annealing (RTA). Such a strategy has successfully produced FLBP samples with a record-long lifetime, with 80% of photoluminescence (PL) intensity remaining after 7 months. The improved material quality of FLBP allows the establishment of a more definitive relationship between the layer number and PL energies. Part II presents the study of oxygen incorporation in FLBP. The natural oxidation formed in the air environment is dominated by the formation of interstitial oxygen and dangling oxygen. By the real-time PL and Raman spectroscopy, it is found that continuous laser excitation breaks the bonds of interstitial oxygen, and free oxygen atoms can diffuse around or form dangling oxygen under low heat. RTA at 450 °C can turn the interstitial oxygen into dangling oxygen more thoroughly. Such oxygen-containing samples show similar optical properties to the pristine BP samples. The bandgap of such FLBP samples increases with the concentration of the incorporated oxygen. Part III deals with the investigation of emission natures of the prepared samples. The power- and temperature-dependent measurements demonstrate that PL emissions are dominated by excitons and trions, with a combined percentage larger than 80% at room temperature. Such measurements allow the determination of trion and exciton binding energies of 2-, 3-, and 4-layer BP, with values around 33, 23, 15 meV for trions and 297, 276, 179 meV for excitons at 77K, respectively. Part IV presents the initial exploration of device applications of such FLBP samples. The coupling between photonic crystal cavity (PCC) modes and FLBP's emission is realized by integrating the prepared sandwich structure onto 2D PCC. Electroluminescence has also been achieved by integrating such materials onto interdigital electrodes driven by alternating electric fields.

Improving solar cell efficiency is an enormously powerful driver of the cost reduction of solar power. While the silicon solar cell efficiency approaches theoretical limits, many thin-film solar cell technologies fall behind. In particular, cadmium telluride (CdTe) solar cells have only reached a maximum efficiency of 22.1%. One of the challenges associated with the development of CdTe solar cells is due its high electron affinity and the difficulty of achieving heavy p-type doping. This challenge results in the formation of a Schottky barrier at the hole contact, which reduces solar cell efficiency, primarily through the reduction of open circuit voltage (Voc) and fill factor (FF). The Schottky barrier makes the characterization of the actual solar cell p-n junction through current voltage (I-V), capacitance voltage (C-V), and thermal admittance spectroscopy (TAS) more difficult and not straightforward. However, interpreted through accurate physical models and under the correct experimental conditions, these techniques can then also be used to extract the impact of the contact on device performance, chiefly through analysis of the barrier height. Additionally, characterization of the open circuit voltage as a function of the illumination intensity (Suns-Voc) and the open circuit voltage as a function of temperature [Voc(T)] offer insight into the potential impact of the contact barrier. A comprehensive review of characterization of the barrier through the above techniques is given, primarily through a two-diode model. Further, a discussion of the utility of electrochemical capacitance-voltage (ECV) profiling to recover carrier concentrations in device regions otherwise difficult to access through traditional C-V measurements is provided along with modeling to support this conclusion. A discussion of and justification for the experimental extraction of barrier height from TAS measurements are also provided. Experimentally measured Voc(T), C-V, and Suns-Voc characteristics are presented and compared for a CdTe and a gallium arsenide (GaAs) solar cell. Experimental results indicate that the contact barriers and other possible non-idealities strongly affect the performance of the CdTe solar cell. Modeling results demonstrate the use of ECV to characterize solar cell absorbers can offer information unavailable via conventional C-V measurements.

The goal of this research work is to develop an understanding as well as modelling thermal effects in Si based nano-scale devices using a multiscale simulator tool. This tool has been developed within the research group at Arizona State University led by Professor Dr. Dragica Vasileska. Another research group, headed by Professor Dr. Thornton, also at Arizona State University, provided support with software tools, by not only laying out the physical experimental device, but also provided experimental data to verify the correctness and accuracy of the developed simulation tool. The tool consists of three separate but conjoined modules at different scales of representation. 1) A particle based, ensemble Monte Carlo (MC) simulation tool, which, in the long-time (electronic motion) limit, solves the Boltzmann transport equation (BTE) for electrons, coupled with an iterative solution to a two-dimensional (2D) Poisson’s equation, at the base device level. 2) Another device level thermal modeling tool which solves the energy balance equations accounting for carrier-phonon and phonon-phonon interactions and is integrated with the MC tool. 3) Lastly, a commercial technology computer aided design (TCAD) software, Silvaco is employed to incorporate the results from the above two tools to a circuit level, common-source dual-transistor circuit, where one of the devices acts a heater and the other as a sensor, to study the impacts of thermal heating. The results from this tool are fed back to the previous device level tools to iterate on, until a stable, unified electro-thermal equilibrium/result is obtained. This coupled electro-thermal approach was originally developed for an individual n-channel MOSFET (NMOS) device by Prof. Katerina Raleva and was extended to allow for multiple devices in tandem, thereby providing a platform for better and more accurate modeling of device behavior, analyzing circuit performance, and understanding thermal effects. Simulating this dual device circuit and analyzing the extracted voltage transfer and output characteristics verifies the efficacy of this methodology as the results obtained from this multi-scale, electro-thermal simulator tool, are found to be in good general agreement with the experimental data.

CdTe/MgCdTe double heterostructures (DHs) integrated with a heavily-doped a-Si:H layer as the hole contact was demonstrated a record open-circuit voltage (VOC) of 1.11 V and an active-area efficiency of 20% in 2016. Despite this significant progress, some of the underlying device physics has not been fully understood. The first part of this dissertation reports a systematic study of the CdTe/MgCdTe DH devices. The CdTe/MgCdTe DHs are grown on InSb(001) substrates. The vertical transport mechanisms across the CdTe and InSb heterovalent interface are investigated with N-CdTe/n-InSb and N-CdTe/p-InSb heterostructures. A transport model including tunneling through CdTe barrier and InSb interband transition is developed to explain the different temperature dependent current-voltage characteristics of these two heterostructures. Different p-type layers are integrated with the CdTe/MgCdTe DHs to form solar cells with different VOC values and efficiencies. The low VOC of devices with ZnTe:Cu and ZnTe:As hole contacts is attributed to the low built-in voltage and reduced minority carrier lifetime in the CdTe absorber, respectively. The critical requirements for reaching high VOC values are analyzed. A novel epitaxial lift-off technology for monocrystalline CdTe is developed using a water-soluble and nearly lattice-matched MgTe sacrificial layer grown on InSb substrate. The freestanding CdTe/MgCdTe DH thin films obtained from the lift-off process show improved optical performance due to enhanced light extraction efficiency and photo-recycling effect. This technology enables the possible development of monocrystalline CdTe thin-film solar cells and 1.7/1.1-eV MgCdTe/Si or MgCdTe/Cu(InGa)Se2 tandem solar cells. The monocrystalline CdTe thin-film solar cells and 1.7-eV MgCdTe DH solar cells have been demonstrated with a power conversion efficiency of 9.8% and an active-area efficiency as high as 15.2%, respectively. Additionally, a study of the radiation effects on CdTe DHs under 68-MeV proton irradiation is performed and showed their superior radiation tolerance. All these findings indicate that the monocrystalline CdTe thin-film solar cells are reasonably expected to have low weight, high-efficiency and high power density, ideal for space applications.

The advent of silicon, germanium, narrow-gap III-V materials, and later the wide bandgap (WBG) semiconductors, and their subsequent revolution and enrichment of daily life begs the question: what is the next generation of semiconductor electronics poised to look like? Ultrawide bandgap (UWBG) semiconductors are the class of semiconducting materials that possess an electronic bandgap (EG) greater than that of gallium nitride (GaN), which is 3.4 eV. They currently consist of beta-phase gallium oxide (β-Ga2O3 ; EG = 4.6–4.9 eV), diamond (EG = 5.5 eV), aluminum nitride (AlN; EG =6.2 eV), cubic boron nitride (BN; EG = 6.4 eV), and other materials hitherto undiscovered. Such a strong emphasis is placed on the semiconductor bandgap because so many relevant electronic performance properties scale positively with the bandgap. Where power electronics is concerned, the Baliga's Figure of Merit (BFOM) quantifies how much voltage a device can block in the off state and how high its conductivity is in the on state. The BFOM has a sixth-order dependence on the bandgap. The UWBG class of semiconductors also possess the potential for higher switching efficiencies and power densities and better suitability for deep-UV and RF optoelectronics. Many UWBG materials have very tight atomic lattices and high displacement energies, which makes them suitable for extreme applications such as radiation-harsh environments commonly found in military, industrial, and outer space applications. In addition, the UWBG materials also show promise for applications in quantum information sciences. For all the inherent promise and burgeoning research efforts, key breakthroughs in UWBG research have only occurred as recently as within the last two to three decades, making them extremely immature in comparison with the well-known WBG materials and others before them. In particular, AlN suffers from a lack of wide availability of low-cost, highquality substrates, a stark contrast to β-Ga2O3, which is now readily commercially available. In order to realize more efficient and varied devices on the relatively nascent UWBG materials platform, a deeper understanding of the various devices and physics is necessary. The following thesis focuses on the UWBG materials AlN and β-Ga2O3, overlooking radiation studies, a novel device heterojunction, and electronic defect study.

Wide bandgap semiconductors, also known as WBG semiconductors are materials which have larger bandgaps than conventional semiconductors such as Si or GaAs. They permit devices to operate at much higher voltages, frequencies and temperatures. They are the key material used to make LEDs, lasers, radio frequency applications, military applications, and power electronics. Their intrinsic qualities make them promising for next-generation devices for general semiconductor use. Their ability to handle higher power density is particularly attractive for attempts to sustain Moore's law, as conventional technologies appear to be reaching a bottleneck. Apart from WBG materials, ultra-wide bandgap (UWBG) materials, such as Ga2O3, AlN, diamond, or BN, are also attractive since they have even more extreme properties. Although this field is relatively new, which still remains a lot of effort to study and investigate, people can still expect that these materials could be the main characters for more advanced applications in the near future. In the dissertation, three topics with power devices made by WBG or UWBG semiconductors were introduced. In chapter 1, a generally background knowledge introduction is given. This helps the reader to learn current research focuses. In chapter 2, a comprehensive study of temperature-dependent characteristics of Ga2O3 SBDs with highly-doped substrate is demonstrated. A modified thermionic emission model over an inhomogeneous barrier with a voltage-dependent barrier height is investigated. Besides, the mechanism of surface leakage current is also discussed. These results are beneficial for future developments of low-loss β-Ga2O3 electronics and optoelectronics. In chapter 3, vertical GaN Schottky barrier diodes (SBDs) with floating metal rings (FMRs) as edge termination structures on bulk GaN substrates was introduced. This work represents a useful reference for the FMR termination design for GaN power devices. In chapter 4, AlGaN/GaN metal-insulator-semiconductor high electron mobility transistors (MISHEMTs) fabricated on Si substrates with a 10 nm boron nitride (BN) layer as gate dielectric was demonstrated. The material characterization was investigated by X-ray photoelectric spectroscopy (XPS) and UV photoelectron spectroscopy (UPS). And the gate leakage current mechanisms were also investigated by temperature-dependent current-voltage measurements. Although still in its infancy, past and projected future progress of electronic designs will ultimately achieve this very goal that WBG and UWBG semiconductors will be indispensable for today and future’s science, technologies and society.