Dehumidifiers are ubiquitous and essential household appliances in many parts of the world. They are used extensively in tropical and sub-tropical environments to lower humidity in living spaces, where high ambient humidity can lead to numerous negative health effects from mild physical discomfort to more serious conditions such as mold build up in structures and dangerous illnesses in humans. Most common dehumidifiers are based on conventional mechanical refrigeration cycles, where the effects of condensation heat transfer play a critical role in their effectiveness. In these devices, humid ambient air flows over a cold evaporator, which lowers the temperature of the humid ambient air below its dew point temperature and therefore decreases its water content by causing liquid water condensation on the evaporator surface. The rate at which humidity can be extracted from the ambient air is governed in part by how quickly the evaporator can shed the condensed droplets. Recent advances in soft, stretchable, thermally enhanced (through the addition of liquid metals) silicone tubing offer the potential to use these stretchable tubes in place of conventional copper pipe for applications such as dehumidification. Copper is a common material choice for dehumidifier evaporator tubing owing to its ubiquity and its high thermal conductivity, but it has several thermal downsides. Specifically, copper tubes remain static and typically rely on gravity alone to remove water droplets when they reach a sufficient mass. Additionally, copper’s naturally hydrophilic surface promotes film-wise condensation, which is substantially less effective than dropwise condensation. In contrast to copper, thermally enhanced soft stretchable tubes have naturally hydrophobic surfaces that promote the more effective dropwise condensation mode and a soft surface that offers higher nucleation density. However, soft surfaces also increase droplet pinning, which inhibits their departure. This work experimentally explores the effects of periodic axial stretching and retraction of soft tubing internally cooled with water on droplet condensation dynamics on its exterior surface. Results are discussed in terms of overall system thermal performance and real-time condensation imaging. An overall null result is discovered, and recommendations for future experiments are made.

Soft polymer composites with improved thermal conductivity are needed for the thermal management of electronics. Interfacial thermal boundary resistance, however, prevents the efficient use of many high thermal conductivity fill materials. Magnetic alignment of ferrous fill material enforces percolation of the high thermal conductivity fill, thereby shifting the governing boundary resistance to the particle- particle interfaces and increasing the directional thermal conductivity of the polymer composite. Magnetic alignment maximizes the thermal conductivity while minimizing composite stiffening at a fill fraction of half the maximum packing factor. The directional thermal conductivity of the composite is improved by more than 2-fold. Particle-particle contact engineering is then introduced to decrease the particle- particle boundary resistance and further improve the thermal conductivity of the composite.

The interface between rigid fill particles is a point contact with very little interfacial area connecting them. Silver and gallium-based liquid metal (LM) coatings provide soft interfaces that, under pressure, increase the interfacial area between particles and decrease the particle-particle boundary resistance. These engineered contacts are investigated both in and out of the polymer matrix and with and without magnetic alignment of the fill. Magnetically aligned in the polymer matrix, 350nm- thick silver coatings on nickel particles produce a 1.8-fold increase in composite thermal conductivity over the aligned bare-nickel composites. The LM coatings provide similar enhancements, but require higher volumes of LM to do so. This is due to the rapid formation of gallium oxide, which introduces additional thermal boundaries and decreases the benefit of the LM coatings.

The oxide shell of LM droplets (LMDs) can be ruptured using pressure. The pressure needed to rupture LMDs matches closely to thin-walled pressure vessel theory. Furthermore, the addition of tungsten particles stabilizes the mixture for use at higher pressures. Finally, thiols and hydrochloric acid weaken the oxide shell and boost the thermal performance of the beds of LMDs by 50% at pressures much lower than 1 megapascal (MPa) to make them more suitable for use in TIMs.

In this study, two novel sorbents (zeolite 4A and sodium polyacrylate) are tested to investigate if utilizing ultrasonic acoustic energy could decrease the amount of time and overall energy required to regenerate these materials for use in cooling applications. To do this, an experiment was designed employing a cartridge heater and a piezoelectric element to be simultaneously providing heat and acoustic power to a custom designed desorption bed while measuring the bed mass and sorbent temperature at various locations. The results prove to be promising showing that early in the desorption process ultrasound may expedite the desorption process in zeolite by as much as five times and in sodium polyacrylate as much as three times in comparison to providing heat alone. The results also show that in zeolite desorption utilizing ultrasound may be particularly beneficial to initiate desorption whereas in sodium polyacrylate ultrasound appears most promising in the after a temperature threshold is met. These are exciting results and may prove to be significant in the future as more novel heat-based cooling cycles are developed.

Thermal interface materials (TIMs) are extensively used in thermal management applications especially in the microelectronics industry. With the advancement in microprocessors design and speed, the thermal management is becoming more complex. With these advancements in microelectronics, there have been parallel advancements in thermal interface materials. Given the vast number of available TIM types, selection of the material for each specific application is crucial. Most of the metrologies currently available on the market are designed to qualify TIMs between two perfectly flat surfaces, mimicking an ideal scenario. However, in realistic applications parallel surfaces may not be the case. In this study, a unique characterization method is proposed to address the need for TIMs characterization between non-parallel surfaces. Two different metrologies are custom-designed and built to measure the impact of tilt angle on the performance of TIMs. The first metrology, Angular TIM Tester, is based on the ASTM D5470 standard with flexibility to perform characterization of the sample under induced tilt angle of the rods. The second metrology, Bare Die Tilting Metrology, is designed to validate the performance of TIM under induced tilt angle between the bare die and the cooling solution in an "in-situ" package testing format. Several types of off-the-shelf thermal interface materials were tested and the results are outlined in the study. Data were collected using both metrologies for all selected materials. It was found that small tilt angles, up to 0.6°, have an impact on thermal resistance of all materials especially for in-situ testing. In addition, resistance change between 0° and the selected tilt angle was found to be in close agreement between the two metrologies for paste-based materials and phase-change material. However, a clear difference in the thermal performance of the tested materials was observed between the two metrologies for the gap filler materials.

Microfluidics is the study of fluid flow at very small scales (micro -- one millionth of a meter) and is prevalent in many areas of science and engineering. Typical applications include lab-on-a-chip devices, microfluidic fuel cells, and DNA separation technologies. Many of these microfluidic devices rely on micron-resolution velocimetry measurements to improve microchannel design and characterize existing devices. Methods such as micro particle imaging velocimetry (microPIV) and micro particle tracking velocimetry (microPTV) are mature and established methods for characterization of steady 2D flow fields. Increasingly complex microdevices require techniques that measure unsteady and/or three dimensional velocity fields. This dissertation presents a method for three-dimensional velocimetry of unsteady microflows based on spinning disk confocal microscopy and depth scanning of a microvolume. High-speed 2D unsteady velocity fields are resolved by acquiring images of particle motion using a high-speed CMOS camera and confocal microscope. The confocal microscope spatially filters out of focus light using a rotating disk of pinholes placed in the imaging path, improving the ability of the system to resolve unsteady microPIV measurements by improving the image and correlation signal to noise ratio. For 3D3C measurements, a piezo-actuated objective positioner quickly scans the depth of the microvolume and collects 2D image slices, which are stacked into 3D images. Super resolution microPIV interrogates these 3D images using microPIV as a predictor field for tracking individual particles with microPTV. The 3D3C diagnostic is demonstrated by measuring a pressure driven flow in a three-dimensional expanding microchannel. The experimental velocimetry data acquired at 30 Hz with instantaneous spatial resolution of 4.5 by 4.5 by 4.5 microns agrees well with a computational model of the flow field. The technique allows for isosurface visualization of time resolved 3D3C particle motion and high spatial resolution velocity measurements without requiring a calibration step or reconstruction algorithms. Several applications are investigated, including 3D quantitative fluorescence imaging of isotachophoresis plugs advecting through a microchannel and the dynamics of reaction induced colloidal crystal deposition.

Thermoelectric devices (TED's) continue to be an area of high interest in both thermal management and energy harvesting applications. Due to their compact size, reliable performance, and their ability to accomplish sub-ambient cooling, much effort is being focused on optimized methods for characterization and integration of TED's for future applications. Predictive modeling methods can only achieve accurate results with robust input physical parameters, therefore TED characterization methods are critical for future development of the field. Often times, physical properties of TED sub-components are very well known, however the "effective" properties of a TED module can be difficult to measure with certainty. The module-level properties must be included in predictive modeling, since these include electrical and thermal contact resistances which are difficult to analytically derive. A unique characterization method is proposed, which offers the ability to directly measure all device-level physical parameters required for accurate modeling. Among many other unique features, the metrology allows the capability to perform an independent validation of empirical parameters by measuring parasitic heat losses. As support for the accuracy of the measured parameters, the metrology output from an off-the-shelf TED is used in a system-level thermal model to predict and validate observed metrology temperatures. Finally, as an extension to the benefits of this metrology, it is shown that resulting data can be used to empirically validate a device-level dimensionless relationship. The output provides a powerful performance prediction tool, since all physical behavior in a performance domain is captured using a single analytical relationship and can be plotted on a singe graph.