Effects of High Impedance Embedded Defects on Local Dynamic Deformation of FCC Materials

This project involved testing and characterization on a shock loaded sample with a single engineered defect to study the effect of inclusions in engineering alloys. The sample was a single crystal copper with an embedded tungsten wire. Hardness testing and EBSD analysis were performed as independent methods of characterizing the effect of a single defect on the adjacent material after a dynamic test. The objective was to define a region of the engineered defect's influence and quantify its effect for improved damage models and material design. EBSD images and hardness results complemented each other, showing evidence of plastic deformation and work hardening in the region around the tungsten wire that decreased moving radially further from it.