Full metadata
Title
Effects of High Impedance Embedded Defects on Local Dynamic Deformation of FCC Materials
Description
This project involved testing and characterization on a shock loaded sample with a single engineered defect to study the effect of inclusions in engineering alloys. The sample was a single crystal copper with an embedded tungsten wire. Hardness testing and EBSD analysis were performed as independent methods of characterizing the effect of a single defect on the adjacent material after a dynamic test. The objective was to define a region of the engineered defect's influence and quantify its effect for improved damage models and material design. EBSD images and hardness results complemented each other, showing evidence of plastic deformation and work hardening in the region around the tungsten wire that decreased moving radially further from it.
Date Created
2024-05
Contributors
- Peterson, Camden (Author)
- Peralta, Pedro (Thesis director)
- Rajagopalan, Jagannathan (Committee member)
- Barrett, The Honors College (Contributor)
- Mechanical and Aerospace Engineering Program (Contributor)
Topical Subject
Resource Type
Extent
25 pages
Copyright Statement
In Copyright
Primary Member of
Peer-reviewed
No
Open Access
No
Series
Academic Year 2023-2024
Handle
https://hdl.handle.net/2286/R.2.N.192536
System Created
- 2024-04-12 05:02:54
System Modified
- 2024-05-08 06:39:46
- 6 months ago
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