Design and Additive Manufacturing of Copper Heat Sinks for Microelectronics Cooling

Thermal management is a critical aspect of microelectronics packaging and often centers around preventing central processing units (CPUs) and graphics processing units (GPUs) from overheating. As the need for power going into these processors increases, so too does the need for more effective thermal management strategies. One such strategy is to utilize additive manufacturing to fabricate heat sinks with bio-inspired and cellular structures and is the focus of this thesis. In this study, a process was developed for manufacturing the copper alloy CuNi2SiCr on the 100w Concept Laser Mlab laser powder bed fusion 3D printer to obtain parts that were 94% dense, while dealing with challenges of low absorptivity in copper and its high potential for oxidation. The developed process was then used to manufacture and test heat sinks with traditional pin and fin designs to establish a baseline cooling effect, as determined from tests conducted on a substrate, CPU and heat spreader assembly. Two additional heat sinks were designed, the first of these being bio-inspired and the second incorporating Triply Periodic Minimal Surface (TPMS) cellular structures, with the aim of trying to improve the cooling effect relative to commercial heat sinks. The results showed that the pure copper commercial pin-design heat sink outperformed the additive manufactured (AM) pin-design heat sink under both natural and forced convection conditions due to its approximately tenfold higher thermal conductivity, but that the gap in performance could be bridged using the bio-inspired and Schwarz-P heat sink designs developed in this work and is an encouraging indicator that further improvements could be obtained with improved alloys, heat treatments and even more innovative designs.