Description

The rationale of this thesis is to provide a thorough understanding of spalling for semiconductor materials and develop a low temperature spalling technology that reduces the surface roughness of the spalled wafers for Photovoltaics applications.

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Details

Title
  • Insights into Crack Dynamics Governing Surface Quality during Spalling of Semiconductors
Contributors
Date Created
2020
Resource Type
  • Text
  • Collections this item is in
    Note
    • Doctoral Dissertation Materials Science and Engineering 2020

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