Most machine learning algorithms, and specifically neural networks, utilize vector-matrix multiplication (VMM) to process information, but these calculations are CPU intensive and can have long run-times. This issue is fundamentally outlined by the von Neumann bottleneck. Because of this undesirable expense associated with performing VMM via software, the exploration of new ways to perform the same calculations via hardware have grown more popular. When performed with hardware that is specialized to perform these calculations, VMM becomes far more power-efficient and less time consuming. This project expands upon those principles and seeks to validate the use of RRAM in this hardware. The flexibility of the conductance of RRAM makes these devices a strong contender for hardware-driven VMM calculation for neural network computing. The conductance of these devices is affected by the pulse width of a voltage signal sent across the devices at each node. This pulse is produced on-chip and can be modified by user inputs. The design of this pulse- producing circuit, as well as the simulated and physical functionality of the design, is discussed in this Honors Thesis. Simulation and physical testing of the pulse-producing design on the ASIC have verified correct operation of the design. This operation is imperative to the future ability of the ASIC to perform accurate VMM.

When exposed to radiation, many electronic components become damaged and operate incorrectly. Making sure these components are resistant to radiation effects is especially important for components used in space flight operations. At low dose rates, a phenomenon known as the enhanced low dose rate sensitivity (ELDRS) effect causes an increase in current within linear bipolar circuits. This increase in current is not desirable for space flight operations. Correctly selecting radiation hardened components or figuring out how to deal with the effects for space operation is important, however, radiation testing each component is very expensive and time consuming. To further the future of space travel, a more efficient way of testing is highly desired by the space industry. A low-cost and time-efficient solution is the IMPACT tool. The Multiscale Tool for Modeling Radiation Effects in Linear Bipolar Circuits project aims to improve the existing IMPACT tool for radiation simulation. This tool contains a database of commonly used linear bipolar circuits and allows the user to model the radiation effects. Currently the tool is not very easy to use and the circuit database is limited. The team’s goal and overall outcome of the project is to deliver the IMPACT tool with a user-friendly interface and an expanded circuit database. The team is using multiple tools to improve the overall appearance of the IMPACT tool and running simulations to collect any necessary data for the database expansion. In our thesis, Kerri and Kylie are using LTSpice simulations to expand the database. Cheyenne is using TCAD modeling to create TCAD models of transistors and compare them with her other group member’s simulations.

When exposed to radiation, many electronic components become damaged and operate incorrectly. Making sure these components are resistant to radiation effects is especially important for components used in space flight operations. At low dose rates, a phenomenon known as the enhanced low dose rate sensitivity (ELDRS) effect causes an increase in current within linear bipolar circuits. This increase in current is not desirable for space flight operations. Correctly selecting radiation hardened components or figuring out how to deal with the effects for space operation is important, however, radiation testing each component is very expensive and time consuming. To further the future of space travel, a more efficient way of testing is highly desired by the space industry. A low-cost and time-efficient solution is the IMPACT tool. The Multiscale Tool for Modeling Radiation Effects in Linear Bipolar Circuits project aims to improve the existing IMPACT tool for radiation simulation. This tool contains a database of commonly used linear bipolar circuits and allows the user to model the radiation effects. Currently the tool is not very easy to use and the circuit database is limited. The team’s goal and overall outcome of the project is to deliver the IMPACT tool with a user-friendly interface and an expanded circuit database. The team is using multiple tools to improve the overall appearance of the IMPACT tool and running simulations to collect any necessary data for the database expansion. In our thesis, Kerri and Kylie are using LTSpice simulations to expand the database. Cheyenne is using TCAD modeling to create TCAD models of transistors and compare them with her other group member’s simulations.

When exposed to radiation, many electronic components become damaged and operate incorrectly. Making sure these components are resistant to radiation effects is especially important for components used in space flight operations. At low dose rates, a phenomenon known as the enhanced low dose rate sensitivity (ELDRS) effect causes an increase in current within linear bipolar circuits. This increase in current is not desirable for space flight operations. Correctly selecting radiation hardened components or figuring out how to deal with the effects for space operation is important, however, radiation testing each component is very expensive and time consuming. To further the future of space travel, a more efficient way of testing is highly desired by the space industry. A low-cost and time-efficient solution is the IMPACT tool. The Multiscale Tool for Modeling Radiation Effects in Linear Bipolar Circuits project aims to improve the existing IMPACT tool for radiation simulation. This tool contains a database of commonly used linear bipolar circuits and allows the user to model the radiation effects. Currently the tool is not very easy to use and the circuit database is limited. The team’s goal and overall outcome of the project is to deliver the IMPACT tool with a user-friendly interface and an expanded circuit database. The team is using multiple tools to improve the overall appearance of the IMPACT tool and running simulations to collect any necessary data for the database expansion. In our thesis, Kerri and Kylie are using LTSpice simulations to expand the database. Cheyenne is using TCAD modeling to create TCAD models of transistors and compare them with her other group member’s simulations.

Most hardware today is based on von Neumann architecture separating memory from logic. Valuable processing time is lost in shuttling information back and forth between the two units, a problem called von Neumann bottleneck. As transistors are scaled further down, this bottleneck will make it harder to deliver performance in computing power. Adding to this is the increasing complexity of artificial intelligence logic. Thus, there is a need for a faster and more efficient method of computing. Neuromorphic systems deliver this by emulating the massively parallel and fault-tolerant computing capabilities of the human brain where the action potential is triggered by multiple inputs at once (spatial) or an input that builds up over time (temporal). Highly scalable memristors are key in these systems- they can maintain their internal resistive state based on previous current/voltage values thus mimicking the way the strength of two synapses in the brain can vary. The brain-inspired algorithms are implemented by vector matrix multiplications (VMMs) to provide neuronal outputs. High-density conductive bridging random access memory (CBRAM) crossbar arrays (CBAs) can perform VMMs parallelly with ultra-low energy.This research explores a simple planarization technique that could be potentially extended to integrate front-end-of-line (FEOL) processing of complementary metal oxide semiconductor (CMOS) circuitry with back-end-of-line (BEOL) processing of CBRAM CBAs for one-transistor one-resistor (1T1R) Neuromorphic CMOS chips where the transistor is part of the CMOS circuitry and the CBRAM forms the resistor. It is a photoresist (PR) and spin-on glass (SOG) based planarization recipe to planarize CBRAM electrode patterns on a silicon substrate. In this research, however, the planarization is only applied to mechanical grade (MG) silicon wafers without any CMOS layers on them. The planarization achieved was of a very high order (few tens of nanometers). Additionally, the recipe is cost-effective, provides good quality films and simple as only two types of process technologies are involved- lithography and dry etching. Subsequent processing would involve depositing the CBRAM layers onto the planarized electrodes to form the resistor. Finally, the entire process flow is to be replicated onto wafers with CMOS layers to form the 1T1R circuit.

Lateral programmable metallization cells (PMC) utilize the properties of electrodeposits grown over a solid electrolyte channel. Such devices have an active anode and an inert cathode separated by a long electrodeposit channel in a coplanar arrangement. The ability to transport large amount of metallic mass across the channel makes these devices attractive for various More-Than-Moore applications. Existing literature lacks a comprehensive study of electrodeposit growth kinetics in lateral PMCs. Moreover, the morphology of electrodeposit growth in larger, planar devices is also not understood. Despite the variety of applications, lateral PMCs are not embraced by the semiconductor industry due to incompatible materials and high operating voltages needed for such devices. In this work, a numerical model based on the basic processes in PMCs – cation drift and redox reactions – is proposed, and the effect of various materials parameters on the electrodeposit growth kinetics is reported. The morphology of the electrodeposit growth and kinetics of the electrodeposition process are also studied in devices based on Ag-Ge30Se70 materials system. It was observed that the electrodeposition process mainly consists of two regimes of growth – cation drift limited regime and mixed regime. The electrodeposition starts in cation drift limited regime at low electric fields and transitions into mixed regime as the field increases. The onset of mixed regime can be controlled by applied voltage which also affects the morphology of electrodeposit growth. The numerical model was then used to successfully predict the device kinetics and onset of mixed regime. The problem of materials incompatibility with semiconductor manufacturing was solved by proposing a novel device structure. A bilayer structure using semiconductor foundry friendly materials was suggested as a candidate for solid electrolyte. The bilayer structure consists of a low resistivity oxide shunt layer on top of a high resistivity ion carrying oxide layer. Devices using Cu2O as the low resistivity shunt on top of Cu doped WO3 oxide were fabricated. The bilayer devices provided orders of magnitude improvement in device performance in the context of operating voltage and switching time. Electrical and materials characterization revealed the structure of bilayers and the mechanism of electrodeposition in these devices.

In recent years, the Silicon Super-Junction (SJ) power metal-oxide semiconductor field-effect transistor (MOSFET), has garnered significant interest from spacecraft designers. This is due to their high breakdown voltage and low specific on-state resistance characteristics. Most of the previous research work on power MOSFETS for space applications concentrated on improving the radiation tolerance of low to medium voltage (~ 300V) power MOSFETs. Therefore, understanding and improving the reliability of high voltage SJMOS for the harsh space radiation environment is an important endeavor.In this work, a 600V commercially available silicon planar gate SJMOS is used to study the SJ technology’s tolerance against total ionizing dose (TID) and destructive single event effects (SEE), such as, single event burnout (SEB) and single event gate rupture (SEGR). A technology computer aided design (TCAD) software tool is used to design the SJMOS and simulate its electrical characteristics.
Electrical characterization of SJMOS devices showed substantial decrease in threshold voltage and increase in leakage current due to TID. Therefore, as a solution to improve the TID tolerance, metal-nitride-oxide-semiconductor (MNOS) capacitors with different oxide
itride thickness combinations were fabricated and irradiated using a Co-60 gamma-source. Electrical characterization showed all samples with oxide
itride stack gate insulators exhibited significantly higher tolerance to irradiation when compared to metal-oxide-semiconductor capacitors.
Heavy ion testing of the SJMOS showed the device failed due to SEB and SEGR at 10% of maximum rated bias values. In this work, a 600V SJMOS structure is designed that is tolerant to both SEB and SEGR. In a SJMOS with planar gate, reducing the neck width improves the tolerance to SEGR but significantly changes the device electrical characteristics. The trench gate SJ device design is shown to overcome this problem. A buffer layer and larger P+-plug are added to the trench gate SJ power transistor to improve SEB tolerance. Using TCAD simulations, the proposed trench gate structure and the tested planar gate SJMOS are compared. The simulation results showed that the SEB and SEGR hardness in the proposed structure has improved by a factor of 10 and passes at the device’s maximum rated bias value with improved electrical performance.

Space exploration is a large field that requires high performing circuitry due to the harsh environment. Within a space environment one of the biggest factors leading to circuit failure is radiation. Circuits must be robust enough to continue operation after being exposed to the high doses of radiation. Bandgap reference (BGR) circuits are designed to be voltage references that stay stable across a wide range of supply voltages and temperatures. A bandgap reference is a piece of a large circuit that supplies critical elements of the large circuit with a constant voltage. When used in a space environment with large amounts of radiation a BGR needs to maintain its output voltage to enable the rest of the circuit to operate under proper conditions. Since a BGR is not a standalone circuit it is difficult and expensive to test if a BGR is maintaining its reference voltage.

This thesis describes a methodology of isolating and simulating bandgap references. Both NPN and PNP bandgap references are simulated over a variety of radiation doses and dose rates. This methodology will allow the degradation due to radiation of a BGR to be modeled easily and affordably. It can be observed that many circuits experience enhanced low dose rate sensitivity (ELDRS) which can lead to failure at low total ionizing doses (TID) of radiation. A compact model library demonstrating degradation of transistors at both high and low dose rates (HDR and LDR) will be used to show bandgap references reliability. Specifically, two bandgap references being utilized in commercial off the shelf low dropout regulators (LDO) will be evaluated. The LDOs are reverse engineered in a simulation program with integrated circuit emphasis (SPICE). Within the two LDOs the bandgaps will be the points of interest. Of the LDOs one has a positive regulated voltage and one has a negative regulated voltage. This requires an NPN and a PNP based BGR respectively. This simulation methodology will draw conclusions about the above bandgap references, and how they operate under radiation at different doses and dose rates.

Analog to Digital Converters (ADCs) are a critical component in modern circuit applications. ADCs are used in virtually every application in which a digital circuit is interacting with data from the real world, ranging from commercial applications to crucial military and aerospace applications, and are especially important when interacting with sensors that observe environmental factors. Due to the critical nature of these converters, as well as the vast range of environments in which they are used, it is important that they accurately sample data regardless of environmental factors. These environmental factors range from input noise and power supply variations to temperature and radiation, and it is important to know how each may affect the accuracy of the resulting data when designing circuits that depend upon the data from these ADCs. These environmental factors are considered hostile environments, as they each generally have a negative effect on the operation of an ADC. This thesis seeks to investigate the effects of several of these hostile environmental variables on the performance of analog to digital converters. Three different analog to digital converters with similar specifications were selected and analyzed under common hostile environments. Data was collected on multiple copies of an ADC and averaged together to analyze the results using multiple characteristics of converter performance. Performance metrics were obtained across a range of frequencies, input noise, input signal offsets, power supply voltages, and temperatures. The obtained results showed a clear decrease in performance farther from a room temperature environment, but the results for several other environmental variables showed either no significant correlation or resulted in inconclusive data.