Full metadata
Title
Modeling of Intel’s Advanced Interface Bus and its Evaluation on a Chiplet-based System
Description
Many of the advanced integrated circuits in the past used monolithic grade die due to power, performance and cost considerations. Today, heterogenous integration of multiple dies into a single package is possible because of the advancement in packaging. These heterogeneous multi-chiplet systems provide high performance at minimum fabrication cost. The main challenge is to interconnect these chiplets while keeping the power and performance closer to monolithic grade. Intel’s Advanced Interface Bus (AIB) is a short reach interface that offers high bandwidth, power efficient, low latency, and cost effective on-package connectivity between chiplets. It supports flexible interconnection of the chiplets with high speed data transfer. Specifically, it is a die to die parallel interface implemented with multiple configurable channels, routed between micro-bumps. In this work, the AIB model is synthesized in 65nm technology node and a performancemodel is generated. This model generates area, power and latency results for multiple technology nodes using technology scaling methods. For all nodes, the area, power and latency values increase linearly with frequency and number of channels. The bandwidth also increases linearly with the number of input/output lanes, which is a function of the micro-bump pitch. Next, the AIB performance model is integrated with the benchmarking simulator, Scalable In-Memory Acceleration With Mesh (SIAM), to realize a scalable chipletbased end-to-end system. The Ground-Referenced Signaling (GRS) driver model in SIAM is replaced with the AIB model and an end-to-end evaluation of Deep Neural Network (DNN) performance is carried out for two contemporary DNN models. Comparative analysis between SIAM with GRS and SIAM with AIB show that while the area of AIB transmitter is less compared to GRS transmitter, the AIB transmitter offers higher bandwidth than GRS transmitter at the expense of higher energy. Furthermore, SIAM with AIB provides more realistic timing numbers since the NoP driver latency is also taken into consideration.
Date Created
2022
Contributors
- CHERIAN, NINOO SUSAN (Author)
- Chakrabarti, Chaitali (Thesis advisor)
- Cao, Yu (Committee member)
- Fan, Deliang (Committee member)
- Arizona State University (Publisher)
Topical Subject
Resource Type
Extent
52 pages
Language
eng
Copyright Statement
In Copyright
Primary Member of
Peer-reviewed
No
Open Access
No
Handle
https://hdl.handle.net/2286/R.2.N.171924
Level of coding
minimal
Cataloging Standards
Note
Partial requirement for: M.S., Arizona State University, 2022
Field of study: Electrical Engineering
System Created
- 2022-12-20 06:19:18
System Modified
- 2022-12-20 06:19:18
- 1 year 10 months ago
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