Full metadata
Title
Printed passive microfluidic devices using TEOS reactive inks
Description
This paper details ink chemistries and processes to fabricate passive microfluidic devices using drop-on-demand printing of tetraethyl-orthosilicate (TEOS) inks. Parameters space investigation of the relationship between printed morphology and ink chemistries and printing parameters was conducted to demonstrate that morphology can be controlled by adjusting solvents selection, TEOS concentration, substrate temperature, and hydrolysis time. Optical microscope and scanning electron microscope images were gathered to observe printed morphology and optical videos were taken to quantify the impact of morphology on fluid flow rates. The microscopy images show that by controlling the hydrolysis time of TEOS, dilution solvents and the printing temperature, dense or fracture structure can be obtained. Fracture structures are used as passive fluidic device due to strong capillary action in cracks. At last, flow rate of passive fluidic devices with different thickness printed at different temperatures are measured and compared. The result shows the flow rate increases with the increase of device width and thickness. By controlling the morphology and dimensions of printed structure, passive microfluidic devices with designed flow rate and low fluorescence background are able to be printed.
Date Created
2016
Contributors
- Huang, Yiwen (Author)
- Hildreth, Owen (Thesis advisor)
- Wang, Robert (Committee member)
- Rykaczewski, Konrad (Committee member)
- Arizona State University (Publisher)
Topical Subject
Resource Type
Extent
vii, 45 pages : illustrations (some color)
Language
eng
Copyright Statement
In Copyright
Primary Member of
Peer-reviewed
No
Open Access
No
Handle
https://hdl.handle.net/2286/R.I.38775
Statement of Responsibility
by Yiwen Huang
Description Source
Viewed on August 11, 2016
Level of coding
full
Note
thesis
Partial requirement for: M.S., Arizona State University, 2016
bibliography
Includes bibliographical references (page 33)
Field of study: Mechanical engineering
System Created
- 2016-06-01 09:00:29
System Modified
- 2021-08-30 01:22:36
- 3 years 3 months ago
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